Used ULVAC TDE 300M Custom #9186778 for sale
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ID: 9186778
Vintage: 2007
3D Plasma etcher
Substrate load station and carrier:
Wafer substrate cassette
(9) Tubular substrates (Φ1.25mm x 8.5")
Parallel fixed spacing: 0.5”-1”
Helium gas cooling
RF Connection
Load-lock isolation chamber:
Based on BROOKS VCE-2 (For wafer substrate cassette)
Load-lock transfer chamber:
Based on BROOKS VTS-4 (Vacuum transfer system)
Isolation valve (VAT Series) MESC-compatible rectangular valve
Substrate transfer robot (4.5 3-Axis Electro Mechanical Solutions)
Control box for RF plasma:
Power distribution components:
Circuit breakers, relays and PLC modules
RF Power supply:
RF Antenna power supply: 40MHz, 1 kW
Vacuum pumping system:
ULVAC LR-90 Load-lock chamber dry pump:
Dry vacuum pump
Transfer chamber dry pump
Process chamber pump
Turbo molecular pump
Computer control system:
Operator interface
PC Based user interface
Programmable logic controller
GE Series
Real time control system based on PLC
Software:
PLC System control software
Windows based NT or higher OS
DDE Server
Process gas inlet system:
Internal framed gas box
Mass flow controlled gas inlet
(4) Process gas lines
316L Stainless steel plumbing, EP, welded with VCR fittings
In-line filters
With additional process chamber POU filtration
Compressed air system:
Valve actuation and door seating
Cooling system (chiller):
Tubular substrate helium gas
Dry air cooling system
Process chamber:
Chamber size: ~59 liters
Dual plates
Capacity: Coupled plasma
Applications:
3-D Tubular substrate dry etching
Currently crated and warehoused
2007 vintage.
ULVAC TDE 300M Custom is an etcher/asher that is designed for precision material processing in a variety of industrial applications. This equipment is capable of performing etching, baking, and sintering on a range of materials, and it is designed for batch operations and custom process programs. TDE 300M Custom system is composed of the core etching and baking chambers, chamber transfer subsystems, and a central control unit. It has a three-stage chamber design with a total chamber volume of 300L, and is suitable for chamber etching and baking operations. The etching chamber has a Maximum Temperature of 1500-1700℃, and the chamber component can reach up to 1600℃in operation. The bake chamber has a Capacity Temperature of 250-500℃, and a Maximum Temperature of 500℃ for baking. ULVAC TDE 300M Custom machine offers a range of features to support precision material etching and baking operations. It has a control tool with a ten-inch LCD screen that provides graphical user interface control of all asset functions, as well as table and graph views of historical process data for easy analysis. It is also integrated with a microprocessor-based microcontroller with a digital signal processor (DSP) for fast and precise temperature management. The model also features built-in safety features such as over-temperature protection, over-power shutoff, and an automatic safety timer to ensure safety during operations. TDE 300M Custom is equipped with a variety of accessories to improve the performance of the equipment. These include water-cooling loops, temperature sensors, a sample thermocouple, pressure transducers, a vacuum thrust plate, programmable digital timers, a vacuum chamber, filter assembly, a turbo molecular pump, and an ion source. ULVAC TDE 300M Custom is a powerful etching and baking system that offers optimal performance and precision for a variety of industrial applications. It is designed to meet the specific needs of manufacturers, and its advanced features and accessories provide reliable, reliable performance even under the most demanding conditions.
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