Used ULVAC Ulvac W200T #184763 for sale

ULVAC Ulvac W200T
Manufacturer
ULVAC
Model
Ulvac W200T
ID: 184763
Wafer Size: 8" 12"
PVD (3) target metal deposition system Can be configured for 8" or 12".
ULVAC Ulvac W200T is a dry film etcher/ asher designed for a variety of precise etching applications. The apparatus consists of a process chamber, substrate stage, gas control equipment, vacuum system, power supply control unit, exhaust machine, and control panel. The process chamber is horizontally configured with windows for observation of the etching process, thus allowing precise control over the etching parameters. The quartz chamber is equipped with flanges for the precise aligning and loading of processed substrates. The substrate stage is a horizontal X-Y-R linear stage with precise stop and repeat accuracy for fast loading and precise alignment of substrate positioning. The stage also contains an inertial optical alignment tool and a rotating substrate attachment for processing circular substrates. The gas control asset is a fully automated model with a digital readout for accurate gas control of etching processes. The gas control consists of two gas lines, one for etchant gas and the other for processing auxiliary gas, both uniform-flow regulated. The vacuum equipment comprises of a turbomolecular high vacuum pump and a quick-release mechanical pump. The turbo-pump allows the process chambers to reach pressures of 10-6 to 10-8 Torr, while the mechanical pump is designed to provide pressures of 200 to 500 mTorr. The power supply control system is adjustable and provides the precise power and control required to etch a variety of circuits. The exhaust unit is an RF-filtered VHF, which ensures maximum etching rates and minimal diffusion. The control panel provides an in-built computer machine and ergonomically placed control knobs for easy and precise control of the etching process. The tool is also equipped with an onboard cooling water asset for improved etching rates and also to keep temperature and etching atmosphere under control. Ulvac W200T is able to accurately etch and deposit a variety of materials from SiO2, SiNx, SiOC, Polyimide, and COC to metals, diamond like carbon (DLC), and carbon nanotubes. The etcher is ideal for a variety of applications including but not limited to microelectronic materials, devices, and circuits.
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