Used ULVAC UNA 2000 #163814 for sale

ULVAC UNA 2000 is an etcher and asher designed for superior process performance in a variety of fabrication processes. This equipment is well-suited for precision microelectronic device fabrication, and offers robust process control for both reactive and non-reactive gas etch and ash processes. UNA 2000 utilizes a load lock chamber for load-unload operations with a heating/cooling plate, photomask plate and substrate plate. It includes a 6-inch to 8-inch single wafer cluster type end effector and a scanning RF susceptor plate with quartz bell nozzle for process flexibility. A comprehensive range of process control mechanisms is provided including an ASTAR II addressable gas manifold for up to 64 gas sources with automatic gas switching capability and mass flow controllers for setting of gas flow rates. The system also contains a vacuum pump, graphite sleeves and shields, hot line trap, cryogenic pump, gas panel and process control software. ULVAC UNA 2000 also comes with an additional Electro-beam control unit and controller, which allow users to program high energy implosion of target substrates. A step-by-step diagnostics menu helps ensure safe and reliable operation of the machine. UNA 2000 is designed with a single wafer mode and a batch process mode, allowing the user to switch between individual or batch substrates. This feature helps to simplify substrate loading and unloading. The tool also comes with a high-precision gas injection and RF substrate heating asset for effective and uniform etching/ashing of targets. ULVAC UNA 2000 is capable of processing up to 2000 substrates per hour and provides an optional cluster controller with touch panel monitor for easy control of wafer movement and status. It includes a monitor for displaying process gas pressure, gas flow, and timing for process control. The model is able to provide process recipes through standard recipe language (SRL) for quick process setup and software downloads. UNA 2000 is an efficient and reliable etcher and asher that provides superior performance in microelectronic device fabrication. The equipment offers robust process control, a comprehensive range of process control mechanisms, high-precision gas injection, and RF substrate heating system, while providing a single wafer and batch process operation. This unit provides users with a quick, safe and robust solution for demanding fabrication processes.