Used ULVAC UNA-2000 #9055148 for sale

ULVAC UNA-2000 is a highly efficient plasma etcher designed for the deposition and etching of thin films. The machine is equipped with a range of features that provide high resolution and accuracy with a variety of materials, including metals, polymers, and ceramics. UNA-2000 has two independent process chambers, a high-precision motorized wafer positioning equipment, and an adjustable support structure that allows for easy variation of substrate size. ULVAC UNA-2000 utilizes a vacuum chamber with an inert gas mixture to deposit and etch thin film materials evenly and precisely. The high-vacuum environment helps to maintain a clean, oxygen-free atmosphere, allowing the plasma to etch without destroying sample material. The two separate process chambers also allow for two different substrates to be processed concurrently. The machine's wafer positioning system is equipped with a high-precision motor unit, allowing for precise beam steering and precise wafer positioning. It also incorporates a range of motion options that allow the user to customize the etching process. The adjustable support structure can be used to easily adjust the size of the substrate, making it compatible with a variety of substrate sizes. UNA-2000 uses source plasma to remove material from the substrate surface, and it is designed to be used in conjunction with a feed gas line, which provides a consistent gas flow. The adjustable feed gas pressure can be used to precisely control the etching process, and the high-purity argon gas supply helps to ensure a consistent gas flow. ULVAC UNA-2000 is a highly reliable and accurate plasma etcher, and it provides excellent etching results with a wide range of materials. The device is also suitable for both batch and batchless operations, making it an ideal choice for any etching application. The machine is designed to meet the highest etching quality specifications, and the built-in high-resolution plasma measurement machine ensures accuracy and repeatability.