Used ADVANTEST T 5371 #9189096 for sale

ADVANTEST T 5371 is a high-speed final test equipment developed by ADVANTEST Corporation for mass production and test verification of semiconductor devices. It efficiently performs testing for chips and integrated circuits, PBGAs (plastic ball grid arrays), and CSPs (chip scale packages). The system is designed to be extremely cost-effective while providing comprehensive automation of the chip testing process. ADVANTEST T5371 is configured with a 2-axis handler, several stages of test equipment, and a tape-out component tray. The 2-axis handler is a robotic arm, controlled by an embedded controller, and is used to manipulate packages of integrated circuits from the feeder, through the various stages of the test unit, and back onto the tray. The various stages of test equipment in the machine include, for example, IC testers, wire bond tester, and a vision/auto-inspect tool. These are all connected to a host computer, and are all controlled by specialized data and test software. T 5371 is equipped with a variety of sensors, both optical and force measuring, to ensure proper alignment of the packages it handles and the accuracy of product insertion into the test stages. It also features a multi-site synchronization test function, which allows it to test several devices simultaneously, and a high-speed socketing asset to reduce down times and improve test throughput. The model also features advanced cycle times and an array of test head configurations. The equipment is capable of testing up to 48 pins in parallel and can perform up to three tests per second per pin. Its 35 nanosecond reaction time is the fastest of its kind and provides the highest throughput on the market, even for devices with a high pin count and high pin functionality. The system also boasts a high yield rate and the highest false-alarm rate of any of its competitors. T5371 is an efficient and cost-effective final test unit for mass production and test verification of semiconductor devices. It provides substantial improvements in cycle times and fast test reaction times, helping to reduce costs associated with the test and assembly process. Its fast testing capabilities, multiple stage test configurations, and high performance ensure that it can meet the stringent requirements of the semiconductor industry.