Used MITSUBOSHI DIAMOND INDUSTRIAL / MDI MM500 #9260349 for sale

The Mitsuboshi Diamond MITSUBOSHI DIAMOND INDUSTRIAL / MDI MM500 Scribing and Dicing equipment is a precision scriber for use in the semiconductor industry. The system is composed of an integrated set of components that enable high-precision scribing and dicing of a variety of glass, ceramic, and silicon wafers. The unit enables high-speed and accurate processing of cutting multiple scribes simultaneously, with high accuracy. At its core, MDI MM500 is a scribe-based machine, featuring a high-powered scriber that allows for precise cutting on various substrates, including dicing and scribing of glass, ceramic, and silicon wafers. The scriber employs a patented counter-balanced blade holder, allowing for smooth, low-vibration operation, resulting in very high-precision scribing and dicing. The tool also features a commercially available 200W diode-laser, enabling precise and repeatable scribing and dicing of a variety of commonly used wafer substrates. MITSUBOSHI DIAMOND INDUSTRIAL MM-500 laser scriber is equipped with an high-performance, automatic focus asset, which enables accurate control of the focus depth for each type of material to be scribed; allowing for greater process flexibility. In addition, MITSUBOSHI DIAMOND INDUSTRIAL / MDI MM-500 Scribing and Dicing model also features high-throughput product handling and automated scribing process. The equipment utilizes dual-rail slides to ensure the accurate and rapid handling of wafers. Once the wafer is placed into the system, software-controlled optimized processing cycles are employed to ensure efficient and accurate scribing and dicing. Finally, MM500 is also provided with various safety features. A safety-interlock mechanism is provided to prevent unauthorized access to the unit, while an emergency switch is provided to protect against sudden power-loss. The machine is certified to comply with ISO 9001, and also with CE certification. MM-500 Scribing and Dicing tool is an ideal choice for the precise and fast scribing and dicing of a variety of common wafer substrates, including glass, ceramic, and silicon. The asset design, features, and safety measures enable reliable and efficient performance, enabling users to quickly and accurately process substrates. With its advanced high-power scriber, diode-laser, and high-throughput product handling, MDI MM-500 is a safe and reliable solution for the automated scribing and dicing of different substrates.