Scribing / Dicing

Semi-automatic dicing saws.

Dicing saw.

Dicing saw, 12".

Dicing saw, 2004 vintage.

Dicing saws, 2002-2003 vintages.

Dicing saw.

Low speed saw 110 Volts.

Scribe & Break system, 4", MS DOS based computer control, dry scribe and anvil impact breaking system. Version 2.40 boot, 2.65 Eprom.

Saber saw With case.

Single wire diamond wire saw, 6" With spare parts Slicing size: 150mm (Wide) x 100mm (High) Water spray system Fully enclosed with lighting Rock: 1°-6° deg Wire break detection system Step & repeat function Air required: 80 PSI Power requirements: 200-230 Volts.

Dicing saw.

Dicing saws 1998-1999 vintages.

Dicing saw, 2" spindle vacuum chuck that can hold up to 6" wafers, steel roller stand included, has 1 optic, 30,000RPM speed range of spindle.

Dicing saw 1990 vintage.

Dicing saw.

Dicing saws.

Dicing saw.

Wafer dicing saw With 4" chuck Maximum chuck size: 6" X-Axis cutting range: 160 mm X-Axis cutting speed: 0.1-500 mm/sec Y-Axis cutting range: 162 mm Y-Axis index step: 0.0001 mm Y-Axis index positioning accuracy: 0.005/160 mm Z-Axis maximum stroke: 32.2 mm Z-Axis moving resolution: 0.00005 mm Z-Axis repeatability accuracy: 0.001 mm Spindle rated output: 1.5 kW Spindle rated torque: 0.49 nm Spindle revolution speed: 3,000 - 40,000 per min Media handler type: Wafer Power: 200-240 V, 50/60 Hz, 3 Phase, 8 A.

Dicing saw 2" Spindle: 1.8kW 2007 vintage.

Dicing saw.