Used BESI (Scribing / Dicing) for sale

Scribing and dicing equipment are crucial in the semiconductor industry for the separation of integrated circuits (ICs) or other materials into individual chips. BESI, a leading manufacturer in the field, offers high-quality scribing and dicing systems that provide precise and efficient solutions. BESI's scribing units utilize advanced technology to perform accurate and clean cuts. These machines are designed to handle various materials, including silicon wafers, gallium arsenide (GaAs), glass, and ceramics. BESI's scribing tools stand out for their exceptional speed, reliability, and versatility. Dicing assets from BESI employ innovative techniques for dividing semiconductor wafers and other fragile materials into individual chips. These models ensure minimal damage to the circuits and enhance the overall yield of IC production. BESI's dicing equipment offer excellent precision, high throughput, and outstanding quality control. One example of BESI's scribing and dicing systems is the FSL (Fully Scalable Laser) platform. The FSL platform combines laser scribing and dicing capabilities, providing an all-in-one solution for various applications. The FSL platform offers advantages such as reduced process time, enhanced accuracy, and improved flexibility. It enables precise geometries, intricate patterns, and edge quality control. Overall, BESI's scribing and dicing units, including the FSL platform, are highly regarded for their cutting-edge technology, reliability, and ability to meet the demanding needs of the semiconductor industry.