Used FICO (Scribing / Dicing) for sale

FICO, known for its innovative and cutting-edge technology solutions, offers a range of scribing/dicing equipment that cater to various industries and applications. These systems are designed to precisely cut and scribe materials such as silicon wafers, glass substrates, ceramics, and other delicate materials used in electronics, semiconductor, optoelectronics, and photovoltaic industries. FICO's scribing/dicing units utilize advanced analogues technologies to ensure high precision and accuracy during the cutting process. These analogues technologies include laser scribing, diamond wheel dicing, and stealth dicing. Laser scribing enables non-contact cutting and precision patterning, diamond wheel dicing provides excellent cutting quality, and stealth dicing minimizes thermal shock and reduces material damage. Some of the advantages of FICO's scribing/dicing machines are their high throughput, superior cutting quality, reduced material waste, and ability to handle a wide range of materials. These tools also offer advanced features like intelligent process control, automatic alignment, and high-speed cutting to enhance productivity and efficiency. FICO has developed several scribing/dicing assets, including the MISS II (Multiple and Independent Scribing System), which allows simultaneous scribing on multiple tracks, resulting in higher throughput. Another example is the FISS (Femtosecond Interference Scribing System) that utilizes ultrafast lasers to create precise scribe lines without thermal damage. Overall, FICO's scribing/dicing models provide advanced analogues technologies, numerous advantages, and a variety of models to suit different industry needs, making them a popular choice among manufacturers in the electronics and semiconductor sectors.