Used KULICKE & SOFFA (Scribing / Dicing) for sale

KULICKE & SOFFA (K&S) is a leading manufacturer of advanced packaging and electronic assembly solutions, including scribing/dicing equipment. These systems are used to separate integrated circuit (IC) chips from semiconductor wafers or substrates. K&S offers a range of scribing/dicing units with advanced features and capabilities. These machines utilize various cutting methods, such as laser dicing or mechanical blade dicing, to achieve precise and clean cuts. They are designed to handle different types of materials, including silicon, glass, and other substrate materials. One of the notable scribing/dicing tools by K&S is the 7300 CSP, which is specifically designed for high-volume chip scale packaging applications. It offers high-speed and high-accuracy cutting capabilities, ensuring the efficient separation of IC chips. Another popular system is the 918, a dicing saw system suitable for various applications, including advanced packaging, MEMS, and compound semiconductors. It offers a combination of advanced technology and flexibility, allowing customers to achieve optimal cutting results and productivity. K&S scribing/dicing assets provide several advantages. Firstly, they offer excellent accuracy, ensuring precise cuts and minimizing the risk of damage to delicate chips. Secondly, they offer high throughput, enabling efficient and fast separation of chips from wafers. Lastly, these models are designed to be easy to use and maintain, ensuring maximum uptime and productivity. Overall, K&S scribing/dicing equipment are highly regarded in the semiconductor industry for their precision, reliability, and advanced features. They cater to a variety of applications and provide efficient and precise solutions for separating IC chips from semiconductor wafers or substrates.