Used MICROAUTOMATION (Scribing / Dicing) for sale

Microautomation is a leading manufacturer of scribing/dicing equipment that are widely used in the semiconductor industry for cutting, shaping, and marking materials such as silicon wafers. These systems are designed to provide precise and efficient processing, ensuring high-quality results for various applications. Microautomation offers a range of scribing/dicing units that cater to different requirements. The M190 is an advanced scribing system that utilizes a laser to accurately scribe materials with minimal heat exposure. It is suitable for cutting delicate materials such as thin films, sensors, and display panels. The M1100 is another popular model that combines scribing and dicing capabilities. This system offers superior cutting quality and process control, enabling high throughput in semiconductor fabrication processes. It is commonly used for dicing silicon wafers into individual chips. The M1006A is a dicing system designed for processing larger wafers. It incorporates precision engineering and advanced automation features to achieve high yield and precision in dicing applications. One of the key advantages of Microautomation's scribing/dicing machines is their ability to perform high-precision cutting with micron-level accuracy. These tools offer excellent process control, ensuring uniformity and consistency in the final product. Moreover, they can handle a wide range of materials, including silicon, glass, ceramics, and compound semiconductors. Microautomation's scribing/dicing assets have been widely adopted in various industries, such as semiconductor manufacturing, photonics, and microelectronics. Their robust design, advanced features, and proven performance make them ideal for applications that require precision processing and high-quality results.