Used WAND / SINGULATION (Scribing / Dicing) for sale

Scribing/dicing equipment play a crucial role in the manufacturing process of electronic devices such as smartphones, tablets, and computer chips. WAND/SINGULATION is a well-known and reputable manufacturer of scribing/dicing systems, offering advanced solutions to meet the industry's demands. WAND/SINGULATION's units are designed to provide precise and efficient scribing/dicing of various materials, including silicon wafers, glass, and ceramic substrates. They employ analogues-based techniques, ensuring optimal performance and accuracy. These machines use diamond blades or laser technology to cut and separate individual components from a larger material, enabling the production of smaller, more precise electronic devices. One of the significant advantages of using WAND/SINGULATION tools is their ability to achieve high-quality scribing/dicing results with minimal material wastage. The accuracy of their assets ensures that the cut components meet the required specifications, helping to improve product yields and reduce manufacturing costs. Popular examples of WAND/SINGULATION products include the 157 P and 2016AL RL2 models. The 157 P model is designed for thin wafer singulation applications and offers exceptional cutting performance and high-speed operations. On the other hand, the 2016AL RL2 model is ideal for glass and ceramic scribing/dicing, providing precise cuts with minimal chipping. Overall, WAND/SINGULATION's scribing/dicing models are widely recognized for their advanced technology, accuracy, and efficiency, making them a preferred choice for manufacturers in the electronics industry.