Used SCHNEIDER CB Bond 09 #9254207 for sale

SCHNEIDER CB Bond 09 is a technologically advanced wafer grinding, lapping and polishing system specifically designed for semiconductor wafer manufacturing processes. An integrated robotic arm takes care of the accurate placement of the wafer, reducing manual labor and improving throughput speed. With an easy-to-use touchscreen interface and robust autocontrol, the able operator will quickly become comfortable with the system's capabilities. For grinding, lapping and polishing, CB Bond 09 features a fully automated process. It has a programmable spindle speed from 1-3000 rpm, adjustable grinding/lapping/polishing pressure, and a feed rate from 0-15 mm/min. The plunge grinding process provides improved surface finish compared to conventional manual grinding and lapping processes, providing both a higher throughput rate and capabilities for smaller micro sizes. A wide range of grinding mechanisms are available for SCHNEIDER CB Bond 09, including diamond and cubic boron nitride. Diamond grinding wheels provide a high-precision grinding and finishing performance, and the wheels are designed to be easily interchangeable. Diamond wheels are highly efficient in materials like tungsten carbide, sapphire, and fused silica. The cubic boron nitride wheels are optimized for polishing operations, giving the best possible surface finish on silicon and other semiconductor materials. CB Bond 09 can also be integrated with other wafer processing systems. Integrating SCHNEIDER CB Bond 09 with a etcher or deprocessor can provide additional wafer processing options and improve yields. For example, a etcher can be used to accurately etch difficult designs into wafer material, while a deprocessor can be used to remove any unwanted residue from a wafer before grinding and lapping. CB Bond 09 is a comprehensive wafer grinding, lapping and polishing system that is capable of meeting the ever-changing requirements of the semiconductor industry. With its user-friendly interface, precise robotic arm, and range of grinding, lapping, and polishing functions, SCHNEIDER CB Bond 09 will provide excellent performance and consistent results.