Wafer Grinding, Lapping & Polishing

Edge grinders.

Back grinder / polisher, 12" Vacuum pump Chiller H1/H2/H4 PG300 Slurry UV Control RM (Wafer mounting, detaping) 2004 vintage.

Wafer edge grinding machine.

Lot of spare parts: 2 50-30040 FILM,30 MICRON DIAMOND LAPPING 9 50-30070 FILM,0.5 MICRON,DIAMOND LAPPING.

CMP Oxide systems, 8" 1998 vintage.

Measuring machine Software version 3.6 SP1.

Triple wheel polishing table (3) Polymet polisher/grinders Each polisher/grinder has independent controls Power rating: 115V, 60Hz, 20.0A.

Hardness tester.

Polisher.

Grinder Chuck, 16" Wheel, 12".

Tool grinder, 1977 vintage.

Blade regrinder.

Vacuum.

Breaker, 2010 vintage.

Features: Siemens 810D CNC Control: Touch Probe System: (2) Steady Rest: Balancing & Detecting Package: Work capacity: Max Swing Over Table: 41.3" Distance Between Centers: 157.5" Centres height: 20.6" Max Grinding Diameter: 33.4" X-Axis Stroke: 25.5" Programmable Speed (X & Z Axis): .0004 -236" IPM Wheel Size, (Right Side): 29.9" x 3.93" Wheel Size, (Left Side): 29.9" x 3.14" Wheel Hub (Both): 12" Wheel Motor: 29 HP Variable Speed Wheel Speed: 8856 SFPM Wheel Head Swivel (+/-): 30 Degrees Workhead Speed: 12-300 RPM Work Head Motor Torque: 42 NM Center Taper: #6 MT Weight Capacity, Unsupported: 5,513 lbs Weight Capacity, Supported: 11,025 lbs Machine Weight: 48,510 lbs Equipped with: Siemens 810D CNC Control Dual Grinding Heads on Same Spindle Danobat Absolute Measuring Option Balancing & Detecting Package Positioning Package Touch Probe System (2) Two Point Steady Rest 3.93" -7.87" Full Splash Enclosure 2005 vintage.

Bench grinder.

Grinding machine (2) HP Aisle: 06B Bay: 2100 Power: 3 Phase / 60 Hz Voltage: 230 / 460.

Grinder 6" x 18" Perm-magnetic Chuck Automatic Recip & Cross Feed 1 HP 1952 vintage.

Saw 1951 vintage.

Rotary surface grinder 1992 vintage.