Used 3D PLUS (Wafer Grinding, Lapping & Polishing) for sale

3D PLUS is a renowned manufacturer and provider of wafer grinding, lapping, and polishing equipment, offering an array of cutting-edge solutions to various industries. These systems are designed to provide precise and efficient processes, ensuring superior quality and performance. The wafer grinding units by 3D PLUS are equipped with advanced technology and automation capabilities, facilitating high-precision wafer thinning. These machines offer exceptional accuracy, allowing for the production of ultra-thin wafers with minimal thickness variation. Notable examples include the P2011-0016-3 and P2011-0016-2 tools, which are widely used for thinning various types of wafers such as silicon, glass, and III-V compound wafers. In addition to wafer grinding, 3D PLUS specializes in lapping and polishing assets that deliver exceptional polishing results and surface quality. The KS B6750 system is a prime example, renowned for its high-precision lapping process, ensuring a smooth and flat surface finish. These models are highly efficient and offer a range of advantages, including improved productivity, reduced processing time, and enhanced yield rates. Overall, 3D PLUS's wafer grinding, lapping, and polishing equipment provide exceptional precision, efficiency, and performance. Their advanced technology and automation capabilities set them apart, ensuring superior results and meeting the requirements of various industries.