Used AM TECHNOLOGY (Wafer Grinding, Lapping & Polishing) for sale

AM Technology is a leading manufacturer of wafer grinding, lapping, and polishing equipment used in the semiconductor industry. These systems are crucial for achieving the desired thickness, flatness, and finish of wafers. The wafer grinding machines from AM Technology, such as the ADL-1000, offer precise control over the grinding process, providing consistent results and excellent thinning capability. These machines have an advanced measurement system that ensures accurate thickness control. The ADL-1000 is suitable for both small and large wafers and offers high throughput and efficiency. The AFS-700A is an excellent example of AM Technology's lapping machine. It provides highly uniform results for wafer flatness and finish, allowing for better adhesion and bonding during subsequent processes. The AFS-700A offers quick setup times and efficient operation, making it ideal for volume production. The ASP-810 is AM Technology's flagship polishing system. It employs advanced polishing technology to achieve outstanding surface quality and flatness on wafers. The ASP-810 offers precision polishing control and can handle a wide range of wafer sizes. Its automated process ensures consistent results and reduces operator fatigue. AM Technology's wafer grinding, lapping, and polishing units provide several advantages, including high precision, excellent uniformity, and optimized throughput. They also offer advanced process control and versatility to cater to various wafer sizes and requirements. In summary, AM Technology's wafer grinding, lapping, and polishing machines, such as the ADL-1000, AFS-700A, and ASP-810, are highly advanced machines that deliver precise results, improved surface quality, and enhanced productivity in the semiconductor industry.