Used ACRA (Wafer Grinding, Lapping & Polishing) for sale

ACRA is a leading manufacturer of wafer grinding, lapping, and polishing equipment that cater to the semiconductor industry. These systems are designed to achieve precise and uniform results, ensuring the highest quality of wafers for various applications. ACRA's wafer grinding units utilize advanced technology and innovative processes to remove excess material from the wafer's surface, improving its flatness and thickness uniformity. This enables the wafer to perform effectively in semiconductor devices. The machines also incorporate analogues that help in controlling and adjusting parameters such as pressure, speed, and time, allowing for customization based on specific requirements. Lapping tools offered by ACRA are known for their superior performance and accuracy. These assets utilize abrasive-filled slurries and rotating plates to remove additional material from the wafer, ensuring a high level of flatness and surface integrity. ACRA's polishing models are designed to achieve the final surface finish of the wafer, resulting in a mirror-like appearance and low surface roughness. One example of ACRA's wafer grinding, lapping, and polishing system is the RS 618. This system combines robust construction with advanced features such as digital controls, automatic lubrication, and easy-to-use interfaces. It provides reliable, efficient, and cost-effective wafer processing solutions for various semiconductor applications. Overall, ACRA's wafer grinding, lapping, and polishing equipment offer numerous advantages, including precise control, uniformity, improved flatness, high productivity, and excellent surface finish. These systems have become an integral part of the semiconductor manufacturing process, ensuring the production of high-quality wafers for a wide range of electronic devices.