Used DAITRON (Wafer Grinding, Lapping & Polishing) for sale

DAITRON is a leading manufacturer of wafer grinding, lapping, and polishing systems for the semiconductor industry. Their state-of-the-art equipment offers precise and efficient solutions for wafer processing. One of DAITRON's notable systems is the WBM-2200, a wafer backside grinding system. It features advanced grinding wheels and a high-precision spindle to ensure uniformity and accuracy during the grinding process. The WBM-2200 allows for fast and precise removal of the backside of wafers, optimizing throughput and reducing production time. Another notable system is the DBM-402R, a double-sided lapping machine. This system is designed for multiple processing steps, including rough grinding, fine grinding, and polishing. It utilizes a planetary motion of the lapping plates to achieve high flatness and parallelism of the wafers. The DBM-402R offers excellent control over material removal rates and ensures consistent results across batches. Additionally, DAITRON offers the WBM-210, a fully automated wafer polishing system. This system delivers superior quality polishing with its advanced pressure control mechanism and optimized polishing pads. The WBM-210 provides high productivity and enables significant reduction in production costs. Overall, DAITRON's wafer grinding, lapping, and polishing systems are known for their high precision, efficiency, and automation capabilities. They provide semiconductor manufacturers with the tools necessary for achieving optimal wafer processing results.