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Wafer Grinding, Lapping & Polishing
DAITRON
DBM-603NR
Used DAITRON DBM-603NR for sale
Wafer Grinding, Lapping & Polishing
Manufacturer
DAITRON
Model
DBM-603NR
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Wafer Size
6"
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Popular Product
DAITRON
DBM-603NR
Breakers, 6" Frame: 2-8-1 Materials: Si, SiC, GsAs, InP, Al2O3 Thickness: 80~400 µm（Al2O3 80~200 µm)
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