SATISLOH is a leading manufacturer of wafer grinding, lapping, and polishing systems. Their range of systems includes various models such as Auto-Flex, Duo-Flex, and SPM 50-2SL, each offering distinctive features and advantages. The Auto-Flex system is designed for the high-volume production of wafers up to 300mm in diameter. It features advanced engineering solutions, enabling low-tolerance grinding with precise flatness and thickness control. The system ensures consistent wafer quality and high throughput, making it an ideal choice for semiconductor manufacturers. The Duo-Flex system is a versatile solution for a wide range of wafer sizes (up to 450mm) and materials. It allows both grinding and polishing processes in a single machine, minimizing production time and maximizing productivity. The system's modular design and various options allow for customization to specific customer requirements. The SPM 50-2SL system is specifically designed for thinner wafer applications, offering outstanding precision and surface quality. It incorporates a state-of-the-art air-bearing spindle, ensuring high stability and control during the lapping and polishing processes. This system is commonly used in the production of MEMS devices and advanced semiconductor applications. The SATISLOH wafer grinding, lapping, and polishing systems are known for their high precision, productivity, and flexibility. They provide customers with improved wafer quality, increased production efficiency, and reduced costs. With a wide range of models and options available, SATISLOH offers tailored solutions to meet the specific needs of various industries and applications.