Used RETSCH (Wafer Grinding, Lapping & Polishing) for sale

RETSCH is a renowned manufacturer of high-quality laboratory equipment, including wafer grinding, lapping, and polishing equipment. These systems are designed to provide precise and efficient sample preparation for various applications. The wafer grinding units from RETSCH, such as the BB 200 and BB 50 models, are used for the rapid and gentle size reduction of semiconductor materials. These machines utilize a feed size up to 40 mm and offer adjustable control of grinding time and speed, ensuring reproducible results. The analogues from other manufacturers include instruments like the Retsch GM 300, Fritsch Pulverisette 0, and SPEX SamplePrep 6770 Freezer/Mill. For lapping and polishing applications, RETSCH offers the ZM-200 model. This system is suitable for the gentle preparation of hard and brittle materials, including ceramics, glasses, and minerals. It features a variable speed setting, allowing users to adjust the rotational speed of the grinding plate for optimal results. One of the advantages of RETSCH wafer grinding, lapping, and polishing tools is their robust construction and reliable performance. These assets are equipped with powerful motors and high-quality materials to ensure long-lasting operation. In conclusion, the wafer grinding, lapping, and polishing models from RETSCH are industry-leading instruments for sample preparation. With their precision, versatility, and durability, they are widely used in research laboratories and industrial settings.