Used SHODA (Wafer Grinding, Lapping & Polishing) for sale

Shoda is a renowned manufacturer of wafer grinding, lapping, and polishing equipment, providing high-quality solutions for semiconductor and electronic industry applications. Their systems are equipped with the latest technologies and advancements to meet the needs of their customers. One of their notable units is the BPM-380C, a wafer grinding system that offers precise and efficient wafer thinning. It utilizes advanced chuck design and control technology to ensure uniform grinding results. The system is also equipped with a high-speed linear motor drive, which allows for high-precision positioning and excellent flatness control. Another system, the MCF-700W, is a lapping and polishing system designed specifically for the semiconductor industry. It is equipped with a unique pressure control mechanism and high-precision polishing pad to achieve exceptional flatness and surface roughness. The MCF-700W also incorporates a user-friendly interface for easy operation and efficient production. The VT-210 is another example of Shoda's wafer grinding system, featuring a vertical spindle design for high-precision grinding processes. It provides excellent control over grinding parameters, ensuring optimal results and high productivity. The VT-210 is suitable for various applications, including silicon grinding and compound semiconductor wafer processing. Shoda's wafer grinding, lapping, and polishing machines offer several advantages, including high precision, excellent flatness control, and efficient production. These tools are developed with the latest technologies and stringent quality control, ensuring reliable performance and meeting the demanding requirements of the semiconductor industry.