Used AEM (Wafer Grinding, Lapping & Polishing) for sale

AEM, a leading manufacturer of wafer processing equipment, offers a range of cutting-edge wafer grinding, lapping, and polishing equipment. These systems are designed to achieve precise and efficient processing of semiconductor wafers. One of AEM's well-known units is the DG-360 WET. It is an advanced dual-spindle grinding system that offers high throughput capabilities. This system utilizes a unique wet grinding process, which improves surface quality and helps minimize the occurrence of defects. The DG-360 WET is equipped with multiple automated features, such as in-situ thickness measurement and real-time feedback control, ensuring excellent process control and repeatability. AEM's wafer grinding, lapping, and polishing machines provide several advantages. Firstly, they offer superior flatness, thickness control, and surface finish, contributing to the overall quality of the finished wafers. Secondly, these tools are highly automated, allowing for increased productivity and reduced operator intervention. Lastly, AEM's assets are designed to be flexible and versatile, accommodating various wafer sizes and types, enabling seamless integration into different production environments. Other examples of AEM's wafer processing models include the DG-570 and DG-600 series. These equipment offer similar benefits and are widely used in the semiconductor industry for applications such as thinning, backgrinding, and polishing of wafers. In conclusion, AEM's wafer grinding, lapping, and polishing systems, including the DG-360 WET, are advanced, automated, and capable of achieving superior surface quality and precision. These units are widely recognized and trusted by semiconductor manufacturers for their excellent performance and reliability.