Used CERATEC JAPAN (Wafer Grinding, Lapping & Polishing) for sale

CERATEC JAPAN is a reputable manufacturer known for its wafer grinding, lapping, and polishing systems. These systems are designed to provide high precision and efficiency in the semiconductor manufacturing process. The HiAZ-A700SSE model is a noteworthy example from CERATEC JAPAN. It offers advanced capabilities such as double-sided grinding and multiple measurement functions. This system allows for efficient removal of material from both sides of the wafer, ensuring precise thickness control. Similarly, the HiAZ-700 model is designed for single-sided grinding with high productivity. It utilizes a fixed abrasive grinding method to achieve excellent surface roughness control. This model is widely used for mass production, particularly in the manufacturing of power devices and MEMS sensors. Another notable system is the HiAZ-A550SSE, which combines grinding, lapping, and polishing functions. It provides a versatile solution suitable for various applications such as silicon wafers, compound semiconductors, and other advanced materials. This model offers high automation and optimized process control. Overall, CERATEC JAPAN's wafer grinding, lapping, and polishing systems are highly regarded in the industry for their precision, efficiency, and versatility. They provide analogues with advanced features and advantages that cater to different manufacturing requirements, resulting in high-quality wafer production.