Used FUJI TECHNICA (Wafer Grinding, Lapping & Polishing) for sale

FUJI TECHNICA is a leading manufacturer of wafer grinding, lapping, and polishing equipment. Their advanced technology and expertise in wafer processing have made them a trusted provider in the semiconductor industry. FUJI TECHNICA offers a range of analogues such as the 2B-7P, 3B-7P, and 3B-8P systems. These units are designed to meet the specific needs of different customers and applications. The advantages of FUJI TECHNICA's wafer grinding, lapping, and polishing machines include high precision, efficient processing, and reliable performance. These tools are equipped with advanced features such as automatic loading and unloading, which improve the productivity and reduce manual labor. They also have built-in process monitoring and control for optimal results. An example of FUJI TECHNICA's wafer grinding system is the 2B-7P. It is a compact and versatile system that can handle various wafer sizes up to 200 mm. This system offers precise grinding control and is compatible with both dry and wet processes. Another example is the 3B-7P system, which is designed for high-volume production. It features a high-speed spindle for efficient grinding and a self-dressing function for reduced maintenance. The 3B-8P is another notable system offered by FUJI TECHNICA. It is a fully automated wafer polishing system that delivers excellent flatness and surface quality. This system is ideal for applications that require superior polishing results. In summary, FUJI TECHNICA's wafer grinding, lapping, and polishing assets are known for their advanced technology, efficient processing, and reliable performance. These models cater to various customer needs and are used in the semiconductor industry for high-volume production and precise wafer processing.