Used DISKUS (Wafer Grinding, Lapping & Polishing) for sale

DISKUS is a well-known manufacturer of wafer grinding, lapping, and polishing equipment, offering high-quality and reliable solutions for the semiconductor industry. Their range of products includes various models like DDS 457R, DDS 1000, DDS 457 II, and more. The wafer grinding systems from DISKUS are designed to achieve precise results and excellent flatness, ensuring high yield rates during wafer fabrication. These units utilize advanced technologies for fine grinding, providing precise control over thickness uniformity and surface roughness. With their digital control machines, operators can achieve repeatable and consistent results. The lapping tools offered by DISKUS are known for their exceptional accuracy and versatility. They employ specialized technologies to remove material from the wafer surface through a process of mechanical grinding. This enables the production of wafers with superior flatness and low surface roughness. DISKUS' polishing assets are designed to deliver the highest level of precision in the final stages of wafer production. These models utilize advanced polishing pads and slurries to achieve excellent surface quality and mirror-like finishes. The polishing pressure, speed, and cycle parameters can be easily adjusted and controlled. The advantages of DISKUS wafer grinding, lapping, and polishing equipment include their high productivity, reliability, and flexibility. They are equipped with automated features and user-friendly interfaces, ensuring efficient operation and reducing the risk of operator errors. Additionally, DISKUS systems offer excellent process repeatability, resulting in consistent quality outcomes. Overall, DISKUS' wafer grinding, lapping, and polishing units are trusted by semiconductor manufacturers worldwide for their exceptional performance, precision, and reliability. With a broad range of models available, such as DDS 457R, DDS 1000, DDS 457 II, and more, DISKUS provides tailored solutions to meet the diverse needs of wafer fabrication processes.