Used ENM (Wafer Grinding, Lapping & Polishing) for sale

ENM is a leading manufacturer of wafer grinding, lapping, and polishing equipment. Their systems are highly regarded in the industry for their exceptional performance and innovative design. The wafer grinding units offered by ENM are equipped with advanced technology that ensures precise and uniform grinding of wafers. These machines utilize a combination of abrasive wheels and coolant to effectively remove excess material and achieve the desired thickness and surface roughness. ENM's wafer grinding tools provide excellent control over critical parameters such as grinding force, speed, and coolant flow, resulting in high-quality and consistent results. ENM's lapping assets are designed to achieve ultra-flat surfaces with high flatness and low surface roughness. These models utilize a combination of abrasives and slurry to remove material from the wafer surface, resulting in improved planarity and surface finish. ENM's lapping equipment offer excellent control over slurry flow, contact pressure, and lapping time, ensuring optimal results for various applications. ENM's polishing systems are designed to achieve mirror-like finishes on the wafer surface. These units utilize a combination of polishing pads, abrasive slurries, and controlled pressure to remove the remaining surface irregularities and improve surface quality. ENM's polishing machines offer advanced features such as automatic pressure control, real-time monitoring, and slurry recycling, ensuring consistent and high-quality polishing results. ENM's wafer grinding, lapping, and polishing tools provide several advantages including excellent process control, high productivity, and flexibility to accommodate different wafer sizes and materials. They are widely used in various industries including semiconductor manufacturing, MEMS fabrication, and optical device production. As an example, ENM offers the G27-55AGC system, which is a fully automated wafer grinding and polishing system. This system is designed to process wafers up to 300mm in diameter and is equipped with advanced features such as real-time thickness measurement, automatic loading and unloading, and intelligent process control. The G27-55AGC system is highly efficient and delivers superior results for demanding applications.