Used NAGAGATA (Wafer Grinding, Lapping & Polishing) for sale

"NAGAGATA" is a renowned manufacturer of wafer grinding, lapping, and polishing equipment. These systems are highly advanced and provide precise and efficient wafer processing solutions for various industries. Wafer grinding is a critical step in semiconductor manufacturing where the wafer thickness is reduced to achieve the desired specifications. NAGAGATA's wafer grinding units use advanced diamond grinding wheels to achieve high precision and uniformity during the grinding process. This ensures the production of high-quality wafers with excellent surface finishes. Lapping machines offered by NAGAGATA use abrasive materials and slurries to remove surface irregularities and improve flatness and parallelism of wafers. These tools are designed to provide high-speed and high-quality lapping with minimal material wastage. NAGAGATA's polishing assets employ innovative technologies to achieve ultra-smooth wafer surfaces with exceptional flatness. These models use various polishing pads and slurries to remove any remaining grinding or lapping imperfections and achieve the desired mirror-like finish. One of the popular equipment manufactured by NAGAGATA is the UTS-3. This system combines wafer grinding, lapping, and polishing functionalities in a single platform, bringing a comprehensive solution to wafer processing. The UTS-3 offers advanced process control features, high throughput, and superior accuracy, resulting in enhanced productivity and yield for semiconductor manufacturers. The advantages of using NAGAGATA's wafer grinding, lapping, and polishing systems include precise and consistent process control, reduced manufacturing costs, improved wafer quality, increased productivity, and enhanced overall performance. These units are widely used in semiconductor, electronics, optoelectronics, and MEMS industries, among others, where wafer processing plays a vital role in the manufacturing process.