Used NANOTECH (Wafer Grinding, Lapping & Polishing) for sale

NANOTECH is a leading manufacturer of precision wafer grinding, lapping, and polishing equipment. These systems are designed to achieve the highest level of surface quality and flatness on semiconductor wafers, MEMS devices, and other thin substrates. The 380-2LC is a wafer grinding system that utilizes a two-wheel design, providing superior flatness and surface finish. It features a unique Load/Unload Carrier (LUC) for faster and more efficient wafer handling. The 140GPM is a lapping and polishing system that uses a three-wheel design to achieve exceptional surface uniformity and planarity on wafers up to 200mm. It offers advanced control features that ensure consistent results. One of NANOTECH's notable units is the NSP-610P, which combines both grinding and polishing capabilities into a single platform. This provides greater flexibility and efficiency in wafer processing. It features advanced automation options and precision control for superior results. NANOTECH's wafer grinding, lapping, and polishing machines offer several advantages. They ensure excellent flatness and surface finish, allowing for consistent and reliable fabrication of semiconductor devices. The tools incorporate advanced control algorithms and automation features, enabling high throughput and process repeatability. Moreover, NANOTECH assets are designed to be user-friendly, with intuitive interfaces and easy maintenance. Overall, NANOTECH's wafer grinding, lapping, and polishing models are highly reliable and efficient, enabling manufacturers to achieve the required quality and precision in semiconductor manufacturing.