Used MOORE (Wafer Grinding, Lapping & Polishing) for sale

MOORE is a renowned manufacturer of high-quality wafer grinding, lapping, and polishing equipment. Their systems are designed to provide exceptional precision and efficiency in the semiconductor industry. The brand offers several models, including the G-18, 450-CP, and 450-CPZ, among others, each offering unique features and benefits. The G-18 model is an analog wafer grinder with a robust construction and advanced control system, ensuring precise grinding. It is equipped with a high-speed grinding spindle, providing excellent surface finish and accuracy. This model is well-suited for small to medium-sized wafers. The 450-CP model, on the other hand, is a lapping system that utilizes a three-point planetary motion for uniform and consistent material removal. It incorporates a programmable lapping cycle, resulting in optimal productivity and reduced operator intervention. It is designed for both rigid and flexible materials. The 450-CPZ represents an advanced version of the 450-CP, offering additional features like in-process thickness measurement and closed-loop feedback control. This model enables precise stock removal and thickness control, ensuring exceptional flatness and surface finish. The MOORE wafer grinding, lapping, and polishing units offer various advantages. These include excellent precision, high productivity, advanced control features, and versatility. The machines are designed to meet the demanding requirements of the semiconductor industry, ensuring optimal wafer quality and yield. In summary, the MOORE wafer grinding, lapping, and polishing tools, such as the G-18, 450-CP, and 450-CPZ, are renowned for their precision, productivity, and advanced features. These assets cater to diverse needs in the semiconductor industry, providing exceptional material removal, flatness, and surface finish.