Used ADVANCE (Wafer Grinding, Lapping & Polishing) for sale

'ADVANCE' is a leading manufacturer of wafer grinding, lapping, and polishing equipment. Their machines are designed to offer superior accuracy, efficiency, and reliability in the semiconductor industry. These systems are essential for the manufacturing of advanced integrated circuits (ICs) used in various electronic devices. The wafer grinding units by 'ADVANCE' utilize advanced technologies to precisely remove the excess material from the wafer surface. This process ensures that the wafer reaches the required thickness and flatness for further processing. The lapping machines employ a combination of rotational and reciprocating motions to achieve high precision and uniformity in the wafer surface. This step helps in achieving the desired surface roughness and removes any surface defects. Lastly, the polishing tools provide a finishing touch to the wafer by removing the finest scratches and improving the overall surface quality. One of the notable wafer grinding, lapping, and polishing assets from 'ADVANCE' is the HG-6B. This model offers excellent performance, high productivity, and advanced automation features. It provides precise control over the grinding, lapping, and polishing parameters, resulting in exceptional surface quality. The HG-6B's robust design ensures extended machine life and reduced maintenance requirements. ADVANCE's wafer grinding, lapping, and polishing models offer several advantages. These include accurate and repeatable material removal, improved wafer flatness and thickness uniformity, enhanced surface characteristics, and reduced manufacturing cycle times. These cutting-edge equipment are widely used by semiconductor manufacturers globally to ensure high-quality IC production.