Used KOYO (Wafer Grinding, Lapping & Polishing) for sale

Wafer grinding, lapping, and polishing equipment play a crucial role in the semiconductor industry by providing precision machining processes to ensure the smoothness and flatness of wafer surfaces. 'KOYO' is a renowned manufacturer that specializes in designing and manufacturing innovative and efficient systems for wafer processing. One of the notable wafer grinding units from 'KOYO' is the DXSG 320. This system offers high grinding accuracy and productivity due to its advanced spindle technology and robust construction. It enables uniform and controlled material removal, resulting in superior surface quality and reduced wafer breakage. Another popular system offered by 'KOYO' is the R631DF. This lapping and polishing machine is designed for high-volume production and offers excellent flatness and parallelism control. It features multiple carriers for simultaneous processing, ensuring efficient and reliable results. The INL-60-S is another example of 'KOYO's' wafer lapping and polishing machines. This model is known for its high-precision and high-production capabilities. It utilizes double-sided polishing and chemical-mechanical polishing techniques for achieving mirror-like surface finishes with nanometer-level accuracy. 'KOYO' tools have several advantages, including precise material removal control, high productivity, superior surface quality, and reduced downtime. These assets are known for their reliability, durability, and easy maintenance, making them suitable for both research and production environments. In summary, 'KOYO' offers a range of wafer grinding, lapping, and polishing models such as the DXSG 320, R631DF, and INL-60-S. These equipment provide efficient and precise wafer processing, resulting in superior surface quality and improved productivity for the semiconductor industry.