Used ICHIKAWA (Wafer Grinding, Lapping & Polishing) for sale

ICHIKAWA is a renowned manufacturer of wafer grinding, lapping, and polishing equipment. Their machines are known for their precision, efficiency, and advanced technology. Wafer grinding systems from ICHIKAWA offer high-speed grinding capabilities to achieve the desired thickness and flatness of the wafers. These units use a fixed abrasive wheel to remove material uniformly from both sides of the wafer, resulting in consistent thickness and flatness across the entire surface. Lapping machines from ICHIKAWA employ a precise and controlled process to remove a small amount of material from the wafer's surface. This process can improve the flatness and surface finish of the wafer, ensuring optimal performance in semiconductor manufacturing. ICHIKAWA's polishing tools utilize advanced techniques and materials to achieve the required surface smoothness and reflectivity. These assets can effectively remove fine scratches, defects, and contamination from the wafer surface, resulting in high-quality finished products. Some examples of ICHIKAWA's wafer grinding, lapping, and polishing models include IBC-240, ICB-800, and IBC-1000. The IBC-240 is a compact and versatile system suitable for small-scale production, research, and development. The ICB-800 is designed for high-volume manufacturing, offering increased productivity and efficiency. The IBC-1000 is a high-precision system capable of handling larger wafers with superior quality and accuracy. The main advantages of ICHIKAWA's wafer grinding, lapping, and polishing equipment are their precision, reliability, and customization options. These systems are built to meet the specific needs of semiconductor manufacturers, ensuring excellent performance, consistent results, and reduced production costs.