Used TOSHIBA (Wafer Grinding, Lapping & Polishing) for sale

Toshiba is a renowned manufacturer of wafer grinding, lapping, and polishing equipment used in semiconductor manufacturing processes. Their systems, such as the KRTC-11A and UHG-130C, provide high-quality and efficient solutions for wafer processing. The wafer grinding units offered by Toshiba employ advanced technologies to ensure precise and uniform material removal from silicon wafers. These machines feature robust grinding wheels and precision control mechanisms that allow for accurate thickness control and surface finish. They also incorporate automated processes to enhance productivity by reducing manual intervention. Toshiba's lapping tools are designed to perform fine surface finishing of wafers. They use sophisticated abrasive materials and can achieve sub-micron level flatness, ensuring excellent planarity. These assets are equipped with user-friendly interfaces and advanced monitoring capabilities for reliable and repeatable results. The polishing models produced by Toshiba offer superior wafer surface polishing using chemical mechanical polishing (CMP) methods. These equipment utilize abrasive slurries along with precise polishing pads to achieve excellent surface planarity and minimal defect levels. They feature advanced process control and monitoring capabilities for optimal polishing results. Toshiba's wafer grinding, lapping, and polishing systems provide several advantages, including high material removal rates, excellent surface quality, enhanced productivity, and precise control over thickness and finish. These units are widely used in the semiconductor industry for the manufacturing of integrated circuits, microchips, and other electronic components. Overall, Toshiba's wafer processing machines are highly regarded for their reliability, efficiency, and advanced technological features.