Used TAMUKAI (Wafer Grinding, Lapping & Polishing) for sale

TAMUKAI is a leading manufacturer of wafer grinding, lapping, and polishing equipment. Their equipment offers high precision and efficiency in the process of wafer thinning, surface flattening, and polishing for semiconductor and electronics industries. One of their popular systems is the TLP-6B, which is designed for grinding and polishing wafers up to 200mm in diameter. It features a fully automated operation with advanced control options, enabling precise material removal and surface quality control. Another model, the TLP-9B, is suitable for larger wafers up to 300mm in diameter and offers enhanced productivity and accuracy. The TAMUKAI TLP-P-810 is a specialized system for polishing hard and brittle materials like sapphire substrates. It uses a unique technique to achieve uniform and smooth surfaces, which is critical for applications in LED manufacturing and other industries. TAMUKAI units have several advantages over competitors. They are known for their exceptional flatness control, thinning uniformity, and low sub-surface damages. These machines also offer outstanding productivity, process optimization, and reliability. Overall, the TAMUKAI wafer grinding, lapping, and polishing machines like TLP-6B, TLP-9B, and TLP-P-810 are highly regarded for their precision, efficiency, and advanced features. These products are widely used in the semiconductor industry and have gained a strong reputation for delivering exceptional results.