Used NANOMETRICS NanoSpec AFT 210 #9265791 for sale

NANOMETRICS NanoSpec AFT 210 is a mask and wafer inspection equipment that can be used for a wide range of applications, including overlay measurement, defect inspection, and process control. This system offers advanced features such as auto focus, ultrafast automation, and a unique 3-D imaging capability. The unit utilizes a patented 3-D imaging process, allowing for precise detection of both surface and sub-surface defects. This is accomplished by combining optical coherence tomography (OCT) and other imaging techniques. OCT is an interferometric imaging process used for non-destructive imaging of surfaces and materials. NANOMETRICS NANOSPEC / AFT 210 is capable of imaging multiple layers simultaneously, with a resolution down to 10nm. The machine is designed to be used in both production environments and for lab use. It has an intuitive graphical user interface, which includes job control, pattern selection, and a feature recognition wizard. It also features the ability to create custom jobs to meet specific user requirements. The tool is equipped with a high resolution CCD camera for advanced image acquisition and analysis. It also has a high speed autofocusing asset that is capable of scan speeds up to 0.5 seconds per line. This allows for rapid and accurate defect detection and process control. The camera lens model also allows for variable magnification up to 2400 X. The equipment has an integrated dual-beam optical system, which ensures accurate and precise overlay measurements. The dual beam operates in the visible and spectral range. It also includes a laser collimation unit, a thin-film metrology tool, and a dark-field microscope. It is certified to SEMI standard S13 for automated mask and wafer inspection. NanoSpec AFT 210 is designed to deliver superior imaging, analysis, and data processing capabilities. This machine offers reliability, accuracy, and a fast turnaround time, making it an ideal choice for mask and wafer inspection. It is capable of providing detailed images, as well as precise profiles for both surfaces and sub-surface defects.