Used RUDOLPH / AUGUST AXI-S #293617880 for sale

RUDOLPH / AUGUST AXI-S is a Mask and Wafer Inspection Equipment designed to offer unprecedented levels of precision and accuracy in assessing the defects on mask and wafer substrates. This system operates according to a scanning principle, using image analysis technology, which sees the mask and wafer substrate scanned with a laser and subsequently analyzed for the presence of any defects. The unit features a high-resolution imaging optics subsystem and a lightning-fast sampling rate (200 images per second), enabling mask and wafer inspections to be completed in a fraction of the time of other inspection systems. AUGUST AXI-S features a powerful automated defect detection algorithm that can accurately identify and classify defects on a variety of production substrates. The machine can detect and identify a wide range of defects including slivers, fuzz, point defects, pits, particles, lines, voids, and total mask defects. Its digital pattern recognition capabilities compare mask or wafer patterns against a specified appearance or feature specification to create digital models. RUDOLPH AXI-S also features a user-centric interface which is easy to navigate, intuitive, and offers a variety of picture comparison and analysis options. This tool offers outstanding performance and provides unsurpassed accuracy and repeatability. With image sensor arrays, high-precision digital servo positioning systems, and embedded imaging algorithms, AXI-S is designed to offer the highest possible accuracy and throughput. The asset is also designed to be fully expandable, enabling users to quickly and easily integrate additional imaging and analysis capabilities. RUDOLPH / AUGUST AXI-S is an innovative, comprehensive mask and wafer inspection model that offers the best in precision and accuracy. With its highly advanced features and user-friendly interface, this equipment is ideal for a wide range of inspection and analysis needs. By enabling users to quickly, easily, and accurately detect and classify mask and wafer defects, this system is the ideal choice for obtaining the highest levels of accuracy and productivity in the inspection and analysis of substrates.