Used RUDOLPH / AUGUST AXI-S #9248722 for sale

RUDOLPH / AUGUST AXI-S is a mask and wafer inspection equipment that is designed to provide efficient and reliable results. It is a full-featured tool that combines high resolution imaging technology with advanced pattern recognition and defect analysis tools to provide detailed and accurate inspection. The system utilizes a scanning electron microscope (SEM) which is capable of magnifying the surface of wafers up to 3000x and is capable of supporting multiple image resolutions. The mask and wafer inspection unit is equipped with two optical systems, one for low resolution imaging and one for high resolution imaging. The low-resolution imaging machine has an image size of up to 600 μm × 600 μm and can magnify the surface of wafers up to 3000x. The high-resolution imaging tool has an image size of up to 50 nm × 50 nm and can magnify the surface of wafers up to 2048x. The mask and wafer inspection asset utilizes a pattern recognition algorithm that is designed to detect microscopic defects and measure their size and shape. This algorithm is capable of performing inspections of wafer surfaces up to 1000 nanometers and can detect feature sizes up to 50 nanometers. The model is also able to analyze defects and distinguish them from intentional features or structures. The mask and wafer inspection equipment has two advanced defect analysis tools. The first is a defect classification algorithm which allows for automated classification of defects based on size, shape, and type. The second is a defect measurement algorithm that can measure feature and defect size and shape. Both algorithms are highly accurate and offer high throughput for efficient results. AUGUST AXI-S is a powerful tool for mask and wafer inspection. It can provide detailed images of wafer surfaces up to 3000x and can detect feature sizes up to 50 nanometers. It has advanced pattern recognition and defect analysis algorithms to accurately detect microscopic defects and classify them based on their shape. It also has two high-throughput defect analysis tools to quickly analyze defects and provide reliable results.