Used RUDOLPH / AUGUST AXI-S #9270934 for sale

RUDOLPH / AUGUST AXI-S is a full-featured mask and wafer inspection equipment designed to meet the demands of the semiconductor industry. This advanced system utilizes a unique, combination of automated optical imaging, x-ray fluorescence spectroscopy, statistical process monitoring, and automated defect analysis to provide high-resolution inspection and assessment of critical IC structures. The unit's automated optical imaging component utilizes a combination of brightfield, oblique, and axial imaging techniques to analyze IC features with high resolution and accuracy. This ensures that even faint images or patterns of features are visible for immediate inspection and analysis. Additionally, the machine's x-ray fluorescence spectroscopy capabilities provide detailed information on the elemental composition of the features of the device. This is beneficial for assessing the presence of dual-damascene metal lines, trenching, etching, metal alloy composition, and any other structural features that may impact device performance. In addition to optical imaging and x-ray fluorescence spectroscopy, AUGUST AXI-S also provides powerful statistical process monitoring. This allows it to capture, store, and analyze over 60 parameters of quality assurance data. This facilitates the pinpointing, tracking, and analysis of trends in device parameters. With this capability, potential issues can be quickly identified and addressed before a significant impact on product quality or reliability occurs. Finally, the tool's automated defect analysis functions enable shorter test cycles and higher throughput. The asset detects subtle variations in images, patterns, and structural features that are indicative of potential defects. The model then uses its in-depth analysis to identify common failure points in a device and provide an immediate recommendation for corrective action. RUDOLPH AXI-S is a powerful, versatile, and accurate mask and wafer inspection equipment that provides efficient detection of subtle variations in IC structures. The combination of optical imaging, x-ray fluorescence spectroscopy, statistical process monitoring, and automated defect analysis ensures that devices are of superior, high-reliability quality. With the use of this system, semiconductor manufacturers can ensure consistently reliable IC products.