Used RUDOLPH / AUGUST AXI-S #9351393 for sale

RUDOLPH / AUGUST AXI-S is an innovative mask and wafer inspection equipment designed to offer users high accuracy and precision. AUGUST AXI-S was developed for a range of applications in the semiconductor production process, particularly for looking for any mask defects or issues on the wafer before it is passed on for later stages of production. The system also works on substrates of different sizes and warpage levels which helps make the inspection process much more efficient. Using the zero-width mask algorithm and an advanced unit of optical and image processing elements, RUDOLPH AXI-S is able to detect multiple types of defects across a large area. The advantages of this machine are that it delivers rapid image acquisition, enabling inspections to be completed quickly and accurately, and the tool is also highly configurable, allowing users to select a wide range of parameters, from image and defect size thresholds to scanning speed and resolution. AXI-S is designed to be easy to use and customize according to specific user requirements, featuring an intuitive Graphical User Interface (GUI) to guide users through the inspection process. The inspection recipes can also be stored and recalled, making it easier to switch from one task to another or monitor changes in the parameters throughout the inspection process. To guarantee more reliable, repeatable results, RUDOLPH / AUGUST AXI-S also features monitoring options like the auto character recognition (ACR) feature. This feature automatically recognizes any changes in the pattern and will prompt users if any irregularities are detected - reducing the margin of error significantly. Thanks to its highly adaptable design, AUGUST AXI-S is also well-suited for a wide range of production environments, from discrete components and integrated circuit (IC) manufacturing to flip chip inspection, 3D contour inspection, and standard wafer inspection. Overall, RUDOLPH AXI-S is an outstanding mask and wafer inspection asset that offers improved fault-tolerance, accuracy, and high-speed inspections. It is an essential addition to any PCB production process, enabling users to rapidly detect surface and subsurface defects while reducing the risk of production bugs.