Used RUDOLPH / AUGUST NSX 115 #293751614 for sale

RUDOLPH / AUGUST NSX 115 mask & wafer inspection system is a highly-sophisticated inspection system used to analyze semiconductor devices, including substrate wafers and masks. Its optical imaging and laser scanning capabilities enable the user to pinpoint defects on the surface and inside of a device. The system comes with a built-in chroma inspection feature, which uses advanced imaging technologies, such as infra-red and ultraviolet scanning, to accurately detect, classify and measure any discrepancies in the color of a device's surface. This helps ensure the components are compliant with industry standards. In addition, AUGUST NSX 115 employs a die-to-die inspection process. This process uses a camera to take multiple images of each die, and compare the images for any discrepancies. This can be used to identify unclean or contaminated areas, and can even uncover latent defects that are not visible to the naked eye. RUDOLPH NSX 115 also comes with a variety of additional features for detailed inspection analysis. These include multi-faceted pattern recognition tools, automated zoom-on-defect capabilities, and the ability to quickly draw contours and labels of die shapes. It also features an integrated 4-dimensional view mode, which displays device structure and composition in 3-dimensional detail. These sophisticated inspection capabilities, combined with its highly-accurate optical imaging, make NSX 115 ideal for use in high-end semiconductor device fabrication. It is a reliable and cost-effective solution for accurately inspecting and overseeing the production of a wide range of devices, in both commercial and laboratory settings.