Used RUDOLPH / AUGUST NSX 115 #9289377 for sale

RUDOLPH / AUGUST NSX 115 is a state-of-the-art Mask and Wafer Inspection Equipment designed to ensure high quality standards in the fabrication of advanced integrated circuits. With up to eight camera heads integrated into the design, AUGUST NSX 115 allows for simultaneous series-based inspection of wafers and CMP panels. This system is capable of high-throughput inspection, offering the capability to examine up to 500 wafers per hour and up to free wafer handling capabilities. It can also detect potential defects in a wafer orientation with the proprietary Augmented Reality (AR) overlay feature, which renders a simulated image of the defect within the exact physical position on the wafer. RUDOLPH NSX 115 utilizes proprietary Eddy currents to evaluate the patterned features on the wafer surface. This allows quick evaluation of metallic corrosion and other defects that may be present on the surface. It also employs diffusion contrast imaging to examine the patterns created on the wafer surface using different photo mask filters. This enables differentiation of defects residing in a feature layer from those in support material or underlying substrate layers. The inspection unit incorporates a variety of sensors, including Electron Beam Inspection, Scanning Acoustic Microscopy, and Wilcoxon. This allows the machine to detect a variety of defects, including line defects, point defects, and height irregularities. Additionally, NSX 115 offers optical inspection to ensure uniformity in patterns, patterns that are inclined or curved, and 3-D feature detections. Finally, RUDOLPH / AUGUST NSX 115 is outfitted with an infrared measurement tool which allows for accurate measurements of a wafer's geometrical features and characteristics. This allows for precise defect data and measurements needed to reliably ensure wafers meet industry standards. Overall, AUGUST NSX 115 is an effective and versatile tool for identifying potential defects and errors in fabrication. With its combination of imaging, sensing, and measurement technologies, the asset is able to quickly inspect wafers and CMP panels, detect irregularities and faults, and deliver accurate measurements for wafer quality assurance.