Used RUDOLPH / AUGUST NSX 330 #9298649 for sale

RUDOLPH / AUGUST NSX 330
ID: 9298649
Vintage: 2015
Automatic Optical Inspection (AOI) system 2015 vintage.
RUDOLPH / AUGUST NSX 330 is a mask and wafer inspection equipment designed to improve process yield and quality by quickly identifying mask and wafer defects. Its advanced optical system uses high-resolution imaging to identify semiconductor defects with an accuracy of 10 nanometers or better. This ensures that the process yields high-quality products with maximum speed and efficiency. AUGUST unit consists of components such as: an LED illuminator, a digital camera, a microscope stage, a wafer support mechanism, an image capturing software package, a filter wheel, a motorized X & Y stage, an industrial PC, and control and operation software. Combined, these components create an automated image inspection machine that can identify, classify and measure small defects on the mask and wafer surfaces. The tool utilizes a patented technique known as "Electron Beam Processing (EBP)". This technique collects image data from the wafer and masks which are then compared with a reference image. The resulting difference map is used to detect and measure fine defects with a resolution of 10 nanometers or better. The asset also has the capability to cycle up to 10 different filter sets to inspect for different types of defects such as particles or scratches. AUGUST NSX 330 model also has a powerful image analysis package that can instantly process captured images and provides comprehensive analysis of the defects detected in an inspection sequence. The equipment also permits batch jobs that allow the user to inspect an unlimited number of wafers and masks with a single process. To ensure a reliable inspection process, RUDOLPH system employs a rigorous quality assurance check and calibration procedure before and after each inspection. This ensures that the unit works properly and efficiently. In conclusion, RUDOLPH NSX-330 is a robust and reliable mask and wafer inspection machine designed to improve the quality, yield and speed of the process assembly. With an accuracy of up to 10 nanometers, this tool is highly accurate, cost-effective, and user-friendly.
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