Used RUDOLPH / AUGUST NSX 330 #9328671 for sale

RUDOLPH / AUGUST NSX 330 is a mask & wafer inspection equipment designed specifically for the analysis of semiconductor wafers. The system features an advanced imaging and analysis technology which use advanced light-field imaging and optical recognition to achieve high resolution images of patterns, particles and defects on wafers. It features a field of view of up to 14 micrometers by 14 micrometers and a high speed image acquisition rate of up to 7 million pixels per second. It also has the capability to perform multiple image capture operations and adds 3D and statistical image analysis techniques to the unit. The imaging capabilities are further improved with the use of a user-selectable, specialized color palettes to allow users to quickly discern defect and features on the wafer. High end imaging technology is further complemented with advanced image recognition algorithms which provide simple but sophisticated processing and interpretation of the images. In addition, the machine has semi-automatic fault isolation and defect density estimation. It can track and localize up to fifteen fault and defect types quickly and accurately. The tool integrates line scan and scattered light imaging tech for achieving high end resolution. Furthermore, AUGUST NSX 330 has a serial interface for communication with external data sources. The asset can be used to inspect and analyse a wide range of semiconductor wafer types, including silicon and gallium arsenide wafers. It can detect and analyze small particles and impurities, as well as large defects. It is built to comply with various industry standards, including the industry standard STDF protocol. RUDOLPH NSX-330 offers a fast and reliable method of mask and wafer inspection. The model is designed for a wide range of applications including pattern recognition, feature detection, fault isolation, and defect density estimation. Its advanced imaging technology and user-friendly interface help to reduce user error and improve wafer analysis.