Used RUDOLPH / AUGUST NSX 90 #9150909 for sale

RUDOLPH / AUGUST NSX 90 Mask & Wafer Inspection Equipment is a high-speed system for inspecting masks or wafers. It is capable of inspecting up to 90wafers in 23seconds in a single stroke, providing high production and throughput. The unit offers a maximum of three axes of motion: Y-axis and X-axis, and a spin tilt (ST) scanner. The Y-axis is used to bring the sample to a suitable inspection position. The X-axis is used for passive alignment relative to the part. The spin-tilt scanner is used for inspection orientation and to ensure uniform lighting conditions. The inspection machine is a fully digital machine and contains advanced optical components. It offers an optical inspection resolution of 20nm and a 3-D repeatability of ± 2μm. The camera is designed for high throughput and high accuracy imaging. The high-performance illumination provides both coaxial and non-coaxial lighting at various angles to capture optimum image details. The inspection tool is equipped with a state-of-the-art image processing asset. It provides high-speed analysis of defect images, with automated defect classification and quick defect inspection. It can detect and identify defects such as tiny bubbles and cracks, missing or wrong parts, warped or misaligned parts, and foreign objects of various sizes. The model also offers comprehensive wafer inspection data analysis, including defect statistics. In addition, AUGUST NSX 90 Mask & Wafer Inspection Equipment is also equipped with additional features such as continuous inspection, sample size adjustment, and batch size adjustment that enable increased productivity and quality control. Other features such as adaptive scanning, multi-focus inspection, job loading and so on also add operational flexibility to the inspection system.