Used RUDOLPH NSX 115D #9232257 for sale

RUDOLPH NSX 115D mask and wafer inspection equipment is a highly advanced machine for the production of integrated circuit (IC) devices that contain optical microelectronic components. With its precision optics, wafer sensor and microprocessor-controlled operations, NSX 115D delivers impeccable accuracy in two inspection modes. Through the first mode, dynamic imaging, this system can complete 15,000 evaluations per hour, using digital images with resolutions as high as 5.0 microns. The second mode, Mapping, enables the operator to precisely calculate a device's dimensions, angles, and tolerances. The unit offers robust machine performance and versatility that are essential for verifying the physical characteristics of complex parts. RUDOLPH NSX 115D offers a wide range of inspection capabilities for both mask and wafer-level applications. This allows users to completely analyze the front and back surfaces of their microelectronic device structures. This tool utilizes automated performance tune-ups that enable rapid data entry with mask and wafer images. Users can customize their analysis to ensure accuracy and capture high quality images over a large area. The asset's imaging modes can detect faults such as chip crevice, IC microfaults, defect points, and external defects. This model is capable of producing 3D data in both a 2D and 3D form. For single-sided mask inspection, the equipment captures much finer details than other mask-inspection systems, such as air gaps, impurities, and defects. Providing accurate and reliable results, NSX 115D mask and wafer inspection system has tremendously increased the production yield of semiconductor components. Its unit stability and accuracy have enabled it to be used in the most complex of production processes, increasing the quality of products and ensuring high reliability.