Used RUDOLPH NSX 90 #9124597 for sale

RUDOLPH NSX 90 is a 3D mask inspection equipment designed to help engineers optimize accuracy and productivity while inspecting photomasks and wafers. The system utilizes non-contact 3D scanning technology to inspect surfaces with highly accurate measurements. By combining interferometric optical microscopy and scanning electron microscopetry, NSX 90 can easily measure patterning defects, particlates, step heights, sidewall widths, gate lengths, critical dimension, and roughness of photomasks and wafers down to 4 microns. RUDOLPH NSX 90 also includes advanced image analysis capabilities. Complex algorithms automatically identify and classify defects according to pre-defined criteria and rules, making defect assessment much faster and more accurate. Additional features include defect classification and annotation capabilities as well as a robust database to store acquired images. The unit also provides up to 16x optical filter options, allowing engineers to focus on specific wavelengths or light sources to reduce unnecessary light reflection for greater contrast between fine geometry features and defects. Additionally, NSX 90 incorporates variable optical curvatures, adjustable focus, low noise temperature control, and a tuned optical machine. The combination of these components results in higher imaging consistency and stability, further improving accuracy. RUDOLPH NSX 90 is designed to streamline mask and wafer inspection, providing engineers with superior workflow optimization, improved yield, and reduced costs. The tool is easy to use and includes a user-friendly UI, allowing users to quickly and effectively access control and measurement functions. As part of the X-RAY Solutions family, NSX 90 provides robust support for X-RAY mask inspection as well as factory automation. Further, RUDOLPH NSX 90's continuous operation capabilities allow for extended periods of time to handle complex board analysis in a tight workflow time frame. On top of that, the asset includes real-time feedback and control functions, helping users to monitor and adjust their inspection parameters in a timely manner. In conclusion, NSX 90 provides engineers with a powerful, efficient, and reliable mask and wafer inspection model. By utilizing advanced 3D scanning technology, engineers can easily inspect and classify defects from photomasks and wafers with maximum accuracy and speed. Additionally, the systems robust optics and image analysis capabilities provide users with real-time feedback and control functions for optimized workflow optimization.