Used RUDOLPH WV 320 #9248814 for sale
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ID: 9248814
Wafer Size: 12"
Macro defect inspection system, 12"
(2) BROOKS Loadports with FOUP
Loadports carrier reader: RFID Type
YASKAWA Robot
Light source:
Head: 20 um
Xenon flash lamps
Wavelength range: 480-750 nm
Resolution: Above 25 um
Function:
YVS Server
3D Defect image generation
Auto Defect Classification (ADC) function.
RUDOLPH WV 320 is an advanced mask and wafer inspection equipment, ensuring that high accuracy and high resolution 3D images are available for the inspection of masks and wafers. It is equipped with advanced optics and an array of macro and micro imaging elements that can be used to inspect a wide variety of mask and wafer geometries. The system's advanced optics unit includes an automated zoom mechanism and polarization filters, which are fully adjustable and can be used to detect subtle defects and examine sub-micron particles or circuit geometries. Its sophisticated 3D imaging machine captures high-resolution results from inspection areas up to 17 mm in size. With its powerful image-processing and analysis functions, RUDOLPH WV320 can detect and measure subtle defects, such as micro-pinholes, scratches, and foreign particles, with up to 10nm precision accuracy. With its built-in wafer alignment function, it can also align samples accurately when inspecting multiple wafer sections at the same time. In addition, WV 320 also has several advanced features that enable efficient and fast mask inspection. It is compatible with most industry-standard CAD systems and can generate high-fidelity 3D models from line scans in order to inspect large masks and complex structures. The tool can be equipped with an iScan laser asset, which is capable of generating 256 non-contact laser scans per second, allowing for high-throughput 3D scanning and imaging. Furthermore, the model's Dynamic Image Tracking Equipment (DITS) can adjust focus and exposure settings during mask inspection to maintain constant image quality. A combined mask and wafer inspection system, WV320 offers excellent performance, reliability, and accuracy. It provides users with up to 3C measurements, better process control, and comprehensive analytics for improved yield and quality. It is the ideal choice for customers who demand accuracy and repeatability in their mask and wafer inspections.
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