Used TEL / TOKYO ELECTRON UW-200Z #9278994 for sale

TEL / TOKYO ELECTRON UW-200Z
ID: 9278994
Wafer Size: 8"
Vintage: 2004
Batch wafer processor, 8" Dry-in / Dry-out Install type: Thru-the-wall (TTW) Automated load/Unload Application: Pre-diffusion clean Bath: 1: POU (Point of Use, configurable) 2: SC1 3: SD2 (HF / IPA Dry) Typical process flow: POU (HF )-> QDR -> SC1 -> QDR -> SD2 Includes: Cabinex CO2 fire suppression system LUFRAN 130-6HH6 DIW Heater UPS For computer only (installed on tool) UPS For full system (stand-alone unit) 2004 vintage.
TEL / TOKYO ELECTRON UW-200Z Wet Station is a top-of-the-line wet chemical processing equipment designed for automated fabrication of integrated circuit devices. With its industrial-grade construction, TEL UW200Z is built for optimal precision and consistent reliability. TOKYO ELECTRON UW 200 Z features two process tanks for a Material Supply Equipment (MSS) and two standard tank sizes with a maximum temperature of up to 370°C. Both process tanks have automated process control functions for automatic process running and monitoring. The station's cooling system is composed of two cooling plates that can be controlled separately for two different temperature requirements. Each tank is equipped with a tool hopper, allowing for the insertion of substrates and cleaning tools. The MSS process tanks use a series of Pumps and a Drain & Fill unit to fill and drain the tanks, using either DI or DI & DI water. Both tanks also feature a Bubble Plate Cleaning Machine to replace outgassing, minimize bubbling, and improve substrate cleaning. TOKYO ELECTRON UW200Z provides a variety of process modules to support automated fabrication of integrated circuit devices. These modules include a Thick Film Strip Extruder, Porous Lamination and Isolation Extrudor (PI), and a Boiling Inhibitor Application (BIA). The Thick Film Strip Extruder is used to produce thick-film resistor strips with uniform thickness and excellent humidity tolerance. The Porous Lamination and Isolation Extrudor (PI) ensures precise positioning and correct conformal contact to the substrate required for uniform void-free lamination and electrical isolation. The BIA is integrated with the PI module and provides a smooth eutectic bond. In addition, the station includes a Substrate Transportation Tool for transporting substrates through the three process tanks. The Station also features a Smart Substrate Management Asset (SSMS) for identifying substrates and optimally transporting them among the three process tanks. TEL UW 200 Z Wet Station is an ideal choice for those seeking top-of-the-line precision and reliability in wet chemical processing. With its comprehensive range of modules and automated processes, TEL UW-200Z provides unparalleled versatility, providing unmatched speed and accuracy for the fabrication of integrated circuit devices.
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