Used ANDA iCoat #9399294 for sale

ANDA iCoat is a photoresist equipment designed for precision photolithography applications in microfabrication environments. The system is specifically designed to handle a wide range of photomask and wafer sizes, providing maximum processing flexibility. ICoat unit uses specialized resist materials and a variety of processes to produce mask patterns with high levels of accuracy, resolution, and repeatability. The machine utilizes and incorporates a variety of technologies such as Dynamic Vacuum Process (DVP) Resist and Resist Hardening Technology (RHT), designed to facilitate consistent, high-quality results regardless of the size or complexity of the pattern. Using ANDA iCoat tool, photomask patterns are created on a wafer substrate using a special laser light source. The laser light reduces the resist material, allowing the desired pattern to be formed on the wafer. The photomask is then developed by photolithography and the desired pattern is formed. Once the pattern is formed on the wafer, further processing is carried out, such as radiation and etching, to create the desired result. ICoat asset is designed to be effective, consistent and repeatable when producing patterned wafers of any size. The process is controlled by automated parameters that allow for repeatable pattern output for all wafer sizes. Additionally, the model includes a variety of tools and aids that help the operator to achieve the desired level of accuracy and repeatability without sacrificing the desired lithographic performance. In order to maximize the effectiveness of the equipment, the operator must be highly trained in the operation of the system itself. ANDA iCoat specifically offers an extensive training course that equips operators with the knowledge and skills to effectively use the unit for all types of applications. ICoat machine offers a variety of advantages, such as its ease of use and rapid rejection rates, as well as its high levels of accuracy and repeatability. The tool offers a fast and efficient way to achieve the desired lithography results, ensuring the integrity of the wafer substrate and the desired results.